ข่าวชิ้นส่วนอิเล็กทรอนิกส์

Toshiba TC3568xFSG Communication ICs are compliant with the Bluetooth low energy standard and are well-suited for applications requiring long-range communication.

ABLIC S-1318 LDO Voltage Regulators are positive voltage regulator ICs developed using the CMOS technology.

Cincon TRE15 and TRE25 Switching Adapters offer universal input, and continuous short circuit and over-voltage protection.

EDAC ZD+ Connectors are 2.5mm pitch high speed connectors with speeds up to 10Gbps per pair.

KEMET Electronics Power Film Capacitors for AC Filtering are polypropylene metalized film capacitors. Now available at Mouser.

Sensata 116CP Pressure Sensors is housed in a small and innovative plastic package ideal for boilers, pumps, and other light industrial applications.

EPCOS / TDK CeraPlas HF Evaluation Kit features a driving circuit that shows the operating principle of the CeraPlas HF cold plasma source.

UDOO SBC-A80-eNUC Single Board Computers (SBCs) are embedded NUC™ type 2 connectivity modules with 101.6mm x 101.6mm dimensions.

Anvo-Systems Dresden ANV32A62 Serial nvSRAM is a 64Kb Serial Interface (I2C) SRAM with a non-volatile SONOS storage element included with each memory cell, organized as 8k words of 8 bits each.

Anvo-Systems Dresden ANV22AA8 Parallel nvSRAM is a 1Mb SRAM with a non-volatile SONOS storage element included with each memory cell, organized as 128k words of 8 bits each.

Anvo-Systems Dresden ANV32AA1 Serial nvSRAM is a 1Mb serial SRAM with a non-volatile SONOS storage element included with each memory cell, organized as 128k words of 8 bits each.

Anvo-Systems Dresden ANV32E61 Serial nvSRAM is a 64kb Serial SRAM with a non-volatile SONOS storage element included with each memory cell, organized as 8k words of 8 bits each.

ATS IGBT Cold Plates feature a mini-channel fin design for unmatched thermal performance.

Inventek Systems Wi-Fi & Bluetooth Combo Modules offer a quick, easy, & cost effective method for adding wireless connectivity to IoT devices.

Laird PowerCool Direct-to-Air Thermoelectric Assemblies control temperatures in small chambers used in medical diagnostics or sample storage compartments in analytical instrumentation.

Particle Argon IoT Development Board is a powerful Wi-Fi enabled development board that can either act as a standalone Wi-Fi endpoint or Wi-Fi enabled gateway for Particle Mesh networks.

Particle Boron IoT Development Board is a powerful LTE CAT-M1/NB1 enabled development board that can either act as a standalone cellular endpoint or LTE enabled gateway for Particle Mesh networks.

Particle Mesh Bundles are the networking modules that include Mesh Wi-Fi bundle, Mesh LTE bundle, Mesh 2G/3G bundle, Mesh Ultimate bundle, and Mesh Hackathon bundle.

Particle FeatherWing Tripler provides space to add-on up to two FeatherWing accessories without any stacking header needs.

Particle Ethernet FeatherWing is the fastest way to add wired connectivity to Argon, Boron, and Xenon IoT development boards.