Mill-Max Low-Profile Interconnect Sockets
Mill-Max Low-Profile Interconnect Sockets are reliable, compact sockets for minimizing interconnect height. These super low-profile sockets feature an above-board height of just 2.11mm (.083"), providing a convenient way of connecting boards or devices. These Mill-Max sockets are ideal for medical wearables and implantable devices and come in single- and double-row versions.
Features
Super low profile, single- and double-row stripsSeries 315 and 415 solder mount sockets use MM #0512 receptacles that accept pin diameters from .015”-.022”Hi-Rel, 4-finger BeCu #12 contact is rated at 3A.083” Super low profile above the board utilizes .050” thick insulatorsInsulators are high temperature thermoplastic, suitable for all soldering operations
Mill max Newest
Mill-Max Solder Cup Connectors and Terminal Pins feature double-action spring-loaded pins, spring-loaded headers, receptacles with no tail, and press-fit receptacles for plated through-hole (PTH).
Date: 2019-07-29Mill-Max Zero Profile Press-Fit Receptacles deliver flush mount solutions for achieving the lowest profile connections possible.
Date: 2019-02-08Mill-Max 868 Series Spring-Loaded Connectors (SLC) are highly durable rugged target connectors for use on 4mm grid. Now available at Mouser.
Date: 2018-11-16Mill-Max Press-Fit PCB Pins for Plated-through Holes are available at Mouser Electronics and provides a secure connection while maintaining plated-through hole integrity and continuity.
Date: 2018-11-13Mill-Max 328 Series .100" Grid Horizontal SMD Headers are suited for low-profile parallel board-to-board or board-to-component mating.
Date: 2018-11-12Mill-Max Series 380 right angle solder cup headers are available at Mouser Electronics and are ideal for low profile wire termination applications.
Date: 2018-08-06Mill-Max Pin Receptacles are board level connectors provide flexibility, quality, and reliability for critical applications.
Date: 2018-07-16Mill-Max Low-Profile Interconnect Sockets are reliable, compact sockets for minimizing interconnect height.
Date: 2018-05-17